| 1. | Section 13. 3 covers the thermocompression bonding process itself and also tape automated bonding .
133节的内容既涉及热压连接工艺本身，也涉及了自动连接的传送带技术。 |
| 2. | Cpk study of bonding process in hic production
混合集成电路键合工序能力指数探索 |
| 3. | Are the ambient conditions controlled for the bonding process
周围是情况吗受约束的为会接程序 |
| 4. | Survey of progress on the bonding process of beryllium and other materials
超高强铝合金的研究现状及发展趋势 |
| 5. | The interfacial microstructure and properties for ti ni in diffusion bonding process
扩散焊接界面的组织和性能 |
| 6. | Mechanics properties of metal materials strengthened by accumulative roll bonding process
累积叠轧焊强化金属材料的力学性能 |
| 7. | Chemical bonding process
化学粘合法 |
| 8. | This product design for ic assembly die bonding process on die bonder machine
本产品是为ic封装自动贴片机及其贴片工艺而设计。 |
| 9. | With bonding process , thin wall magnet and magnet with complex shapes can be obtained
各向同性，可多极和辐向充磁。能制成薄壁形状复杂的磁体。 |
| 10. | Experiments were conducted to modify the bonding process to reduce the effects of the critical events
实验证实，改进的键合工艺可以降低关键事件对晶片偏转的影响。 |
